What are the classifications of integrated circuit chips for the Internet of Things?

The integrated circuit chip of the Internet of Things is a kind of integrated circuit chip suitable for application in the Internet of Things project according to the market orientation and application requirements.

 

The Internet of Things (LOT) is to connect devices and objects to the Internet, and then implement services based on them. To achieve this goal, IoT system devices require a three-layer architecture: core layer devices, middle layer devices, and edge layer devices.

 

According to the three-level theory of the physical network, to do information calculation and decision-making processing at the core layer of the Internet of Things, an operation processing chip is required, that is, an Internet of Things processor; at the middle layer of the Internet of Things, it is mainly used for information transmission, and radio frequency processing chips are required for unlimited transmission. Limited transmission requires routing and switching chips; at the edge layer of the Internet of Things, information perception requires sensor devices or IC chips that integrate power management, energy acquisition, and sensor display. Among the execution parts, IC chips for the calculation processing part and the power drive part are required.

 

To sum up, physical network integrated circuit chips are basically divided into the following types.

 

1. Computational processing chips: various IoT processors with different digits and frequencies.

2. Communication chips: RF baseband chips, routing, switching chips.

3. All kinds of IoT, chemical, biological, motion information sensor chips, power drive chips.

4. A low-cost passive chip that integrates sensing modules, communication modules, and processing modules.

 

The integrated circuit chip architecture of the Internet of Things includes sensor devices, processors, on-chip and off-chip memories, I/O interfaces, etc. New methods and new processes for chip design, production, and packaging are also emerging, including custom ASIC methods, flow layers for designing SOCs in the EAD environment, 2.5D chip processes for networks and servers, and for MEMS and sensors (arrays) ) cluster fan_out wafer level chip packaging technology. Issues of data confidentiality and information security should also be considered in the development of IoT chips for automobiles, medical equipment and industrial control systems.

 

Universal IoT IC chips are designed to not only cover one application, but also handle multiple applications. There are many generic versions of IoT ICs though. But in some cases, IoT IC design engineers make designs for dedicated IoT IC chips and then try to reuse them for other IoT projects (design reuse). In the future, more IoT-specific chips specially designed for specific applications will be available on the market.